Description
Hydronaut Pro is a silicone-free thermal paste with an optimised composition, suitable for use in both industrial systems and high-performance PC systems. Thanks to its superior thermal conductivity, it is particularly ideal for applications with large-surface-area heat sinks, such as gaming PCs with custom water cooling. Hydronaut Pro combines high performance with an attractive price-performance ratio and is also designed for overclocking applications.
Features
- Suitable for industrial applications
- Outstanding thermal conductivity
- Silicone-free
- Non-electrically conductive
- No curing
Silicone-free for industrial systems
The Hydronaut Pro thermal paste has a silicone-free carrier structure. Many thermal pastes use silicone-based oils (e.g., siloxanes) as carrier fluids or as part of the matrix. Under thermal stress, especially with temperature fluctuations, changes in the paste can occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature changes and micro-movements between the CPU IHS and the cooler base can exacerbate this effect. The mechanical displacement of the paste from the contact surface is known as the pump-out effect. In normal PC use, this is generally not critical. However, in industrial applications, leaking silicone-based oil can be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties. The product is RoHS-compliant and designed as an easy-to-apply thermal medium for demanding users.
| Colour | |
| Primary Colour | Green |
| Contents | |
| Weight (Contents) | 2 g |
| Compatibility | |
| Compatibility Note | Please refer to the manufacturer's compatibility information. You can find the latest overview on the manufacturer's website. |
| Materials | |
| Electrically Conductive | No |
Features
General
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