Description
Powerful Alternative to Thermal Paste
With the Thermal Grizzly Minus Pad Pro, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on its predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Pro is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore optimal for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste.
The Minus Pad is available in various dimensions and thicknesses ranging from 0.5 to 3 millimetres. Since it works optimally even with minimal contact pressure and thermal conductivity is hardly affected by thickness, the choice of thickness should only be based on the distance to be bridged.
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Colour
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Primary Colour
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Grey
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Dimensions
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Length / Depth
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120 mm
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Width
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20 mm
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Height
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1 mm
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Materials
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Materials
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Aluminium oxide
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Electrically Conductive
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No
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Features
General
Reviews
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