Description
With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore optimal for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving a similar thermal conductivity to thermal paste.
The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimetres. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly influenced by thickness, the choice of thickness should only be matched to the distance to be bridged.
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Colour
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Primary Colour
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Grey
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Dimensions
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Length / Depth
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120 mm
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Width
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20 mm
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Height
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2 mm
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Materials
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Materials
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Aluminium oxide
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Electrically Conductive
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No
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Features
General
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