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- 2 Years Limited Warranty
- Door to Door Delivery
- Store Pickup Available
- All Prices include 19% VAT.
- All prices exclude shipping and delivery costs which are calculated during checkout.
- You will be updated on any status change of your order via automated emails
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Cyprus |
3-7 Working Days |
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Austria, Belgium, Bulgaria, Croatia, Czech Republic, Denmark, Estonia, Finland, France, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Monaco, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, United Kingdom (Great Britain) |
7-15 Working Days |
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Bahrain, Belarus, Egypt, Israel, Lebanon, Oman, Qatar, Russian Federation, Saudi Arabia, Ukraine, United Arab Emirates |
7-15 Working Days |
Description
With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on its predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.
The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore perfectly suited for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving a similar thermal conductivity to thermal paste.
The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimetres. Since it works optimally even with minimal contact pressure and its thermal conductivity is hardly influenced by thickness, the choice of thickness should only be aligned with the distance to be bridged.
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Colour
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Primary Colour
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Grey
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Dimensions
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Length / Depth
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120 mm
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Width
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20 mm
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Height
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1.5 mm
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Materials
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Materials
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Aluminium oxide
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Electrically Conductive
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No
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Product Features
Features
General
In The Box
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